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  may 2011 doc id 018813 rev 1 1/10 10 STPS40M60C high efficiency 60 v power schottky rectifier features high current capability avalanche rated low forward voltage drop low leakage current high frequency operation description this dual diode schottky rectifier is suited for high frequency switch mode power supply. packaged in to-220ab, i 2 pak and d 2 pak, this device is particularly suited for use in notebook, game station and desktop adapters, providing these applications with a good efficiency at both low and high load. figure 1. electrical characteristics (a) table 1. device summary symbol value i f(av) 2 x 20 a v rrm 60 v t j (max) 150 c v f (typ) 385 mv a. v arm and i arm must respect the reverse safe operating area defined in figure 13 . v ar and i ar are pulse measurements (t p < 1 s). v r , i r , v rrm and v f , are static characteristics a1 k a2 a1 a2 k k a1 a2 k k to-220ab STPS40M60Ct i 2 pak STPS40M60Cr d 2 pak STPS40M60Cg-tr a1 a2 k i f 2 x i o i o i r i ar v f(i o ) v to v f(2xi o ) v f v i i v v r v rrm "reverse" "forward" v ar x x www.st.com
characteristics STPS40M60C 2/10 doc id 018813 rev 1 1 characteristics when the two diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode, at t amb = 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 30 a i f(av) average forward current, = 0.5 t c = 130 c t c = 120 c per diode per device 20 40 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 220 a p arm (1) 1. for temperature or pulse time durat ion deratings, please refer to figure 3 and 4. more details regarding the avalanche energy measurements and diode validation in the avalanc he are provided in the application notes an1768 and an2025. repetitive peak avalanche power t j = 25 c, t p = 1 s 23000 w v arm (2) 2. see figure 13 maximum repetitive peak avalanche voltage t p < 1 s, t j < 150 c, i ar < 86.3 a 80 v t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (3) 3. condition to avoid thermal runaway for a diode on its own heatsink 150 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode 1.40 c/w total 0.95 r th(c) coupling 0.50 c/w dptot dtj < 1 rth(j-a)
STPS40M60C characteristics doc id 018813 rev 1 3/10 to evaluate the conduction losses use the following equation: p = 0.395 x i f(av) + 0.007 x i f 2 (rms) table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = 60 v - 25 110 a t j = 125 c - 85 ma v f (2) forward voltage drop t j = 25 c i f = 5a - 0.430 0.460 v t j = 125 c - 0.325 0.355 t j = 25 c i f = 10 a - 0.470 0.505 t j = 125 c - 0.385 0.435 t j = 25 c i f = 20 a - 0.540 0.595 t j = 125 c - 0.475 0.535 t j = 25 c i f = 40 a - 0.645 0.730 t j = 125 c - 0.605 0.675 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % figure 2. average forward power dissipation versus average forward current (per diode) figure 3. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 0 2 4 6 8 10 12 14 16 0 2 4 6 8 101214161820222426 =0.05 = 0.1 = 0.2 = 0.5 t =tp/t tp i (a) f(av) =1 i (a) f(av) 0 2 4 6 8 10 12 14 16 18 20 22 24 0 25 50 75 100 125 150 r th(j-a) =r th(j-c) t (c) amb
characteristics STPS40M60C 4/10 doc id 018813 rev 1 figure 4. normalized avalanche power derating versus pulse duration figure 5. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 6. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 7. relative thermal impedance junction to case versus pulse duration i (a) m 0 20 40 60 80 100 120 140 160 180 200 220 240 260 1.e-03 1.e-02 1.e-01 1.e+00 t c =25c t c =75c t c =125c i m t =0.5 t(s) z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p figure 8. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 9. junction capacitance versus reverse voltage applied (typical values, per diode) i (ma) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0102030405060 t j =150c t j =125c t j =25c t j =100c t j =50c t j =75c v (v) r c(pf) 100 1000 10000 110100 f=1mhz v osc =30mv rms t j =25c v (v) r
STPS40M60C characteristics doc id 018813 rev 1 5/10 figure 10. forward voltage drop versus forward current (per diode, low level) figure 11. forward voltage drop versus forward current (per diode, high level) i (a) fm 0 5 10 15 20 25 30 35 40 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 tj=25c (maximum values) tj=125c (maximum values) tj=125c (typical values) v (v) fm i (a) fm 0.1 1.0 10.0 100.0 1000.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 tj=25c (maximum values) tj=125c (maximum values) tj=125c (typical values) v (v) fm figure 12. thermal resistance junction to ambient versus copper surface under tab for d 2 pa k figure 13. reverse safe operating area (t p < 1 s and t j < 150 c) r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 dpak 2 epoxy printed board fr4 copper thickness = 35 m s (cm ) cu 2 i (a) arm 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 80 85 90 95 100 105 110 115 120 125 130 v (v) arm forbidden area permitted area
package information STPS40M60C 6/10 doc id 018813 rev 1 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. dia. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
STPS40M60C package information doc id 018813 rev 1 7/10 figure 14. d 2 pak footprint (dimensions in mm) table 6. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
package information STPS40M60C 8/10 doc id 018813 rev 1 table 7. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
STPS40M60C ordering information doc id 018813 rev 1 9/10 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode STPS40M60Ct STPS40M60Ct to-220ab 2.2 g 50 tube STPS40M60Cr STPS40M60Cr i 2 pak 1.6 g 50 tube STPS40M60Cg-tr STPS40M60Cg d 2 pak 1.5 g 1000 tape and reel table 9. revision history date revision changes 11-may-2011 1 first issue.
STPS40M60C 10/10 doc id 018813 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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